InSb (100) 10x10x 0.3 mm, N type, Te doped, 1 side polished Orientation -201 Model EQ-Die-60D Die Sleeve Height

Model  EQ-Die-60D Die Sleeve Height   2 3/8" (60 mm) Inside Diameter   2 3/8" (60 mm) Outside Diameter   3 3/4" (101mm) Weight  20 Lbs

opto-electronics and other microelectronics devices

Multi-holes are available upon request at an extra cost

(which can be attached to the magnetic plate at the stable and take off at easy) 4 set UP820-05 8" Sic sandpapers (2 of each at the mesh of 240#

and other powders

InSb (100) 10x10x 0.3 mm, N type, Te doped, 1 side polished Orientation -201 Model EQ-Die-60D Die Sleeve Height10x10x0. 45 mm InSb wafer (N type, Te doped) Size: 10x10x0. 3 mm Orientation <100> + 0. 5o with two reference flats Polishing: one side side polishd ( back side etched ) Packing: Sealed under nitrogen with single wafer comtainer in 1000 class clean room Properties Growth method LEC Orientation (100) + 0. 5o Doping Te doped Conductivity type N type Carrier Concentration (0. 19 0. 5)E18 @77K Mobility >(3. 58 5. 6)E4 cm2 Vs EPD <1200 1500 cm 2