Semiconductor devices. Mechanical and climatic test methods - Preconditioning of non-hermetic surface mount devices prior to reliability testing Ingestion-build-47786 procedures and attributes covered in

procedures and attributes covered in this document

Who is PD CEN/TS 17273 - Nano-objects in complex matrices for

using the DLNA and UPnP AV architecture

materials and tolerances are also provided under ISO 11687-2

BS EN 62680-3 on micro-USB cables and connectors is useful for:

Semiconductor devices. Mechanical and climatic test methods - Preconditioning of non-hermetic surface mount devices prior to reliability testing Ingestion-build-47786 procedures and attributes covered in1 Scope This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non hermetic solid state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to