99% (AlN5116) Size: 1" x 1" x 0. 5 mm Polishing: one side polished Surface Roughness: < 100A RMS"> 99% (AlN5116) Size: 1" x 1" x 0. 5 mm Polishing: one side polished Surface Roughness: < 100A RMS"> 99% (AlN5116) Size: 1" x 1" x 0. 5 mm Polishing: one side polished Surface Roughness: < 100A RMS"> AlN Ceramic Substrate 1"x1"x 0.5mm, 1SP - CmAlN252505S1 Ni-Coated Si Cutting Pressure Force Max – drankurprakash.com

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AlN Ceramic Substrate 1"x1"x 0.5mm, 1SP - CmAlN252505S1 Ni-Coated Si Cutting Pressure Force Max

$109.25

Quantity
Description

Cutting Pressure Force Max

Slurry and labor-saving

Polished surface:   Wafer surface is EPI polished via a special CMP procedure

Please click the picture below to see XRD and particle distribution curve

Surface finish (RMS or Ra) : < 8A

AlN Ceramic Substrate 1"x1"x 0.5mm, 1SP - CmAlN252505S1 Ni-Coated Si Cutting Pressure Force MaxSpecifications: AlN Ceramic Substrate made by tape casting Purity: > 99% (AlN5116) Size: 1" x 1" x 0. 5 mm Polishing: one side polished Surface Roughness: < 100A RMS

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