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Electronic components. Long-term storage of electronic semiconductor devices - Die and wafer devices Ingestion-build-126766 PAS 197 sets out a1 Scope This part of IEC 62435, is applicable to long term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling