G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded Standardization of these component interfaces

Standardization of these component interfaces will allow for interchangeability of gas distribution system components

2  This Standard specifies the application of the appropriate processing to specified material received at the processing agent

The first stack (refer to Figure 1) is a BWS pair of 775 µm thick wafers following TSV formation and the bonding operation

The purpose of this Standard is to provide recommendations for defining a comprehensive training system for both suppliers and users of equipment for the semiconductor and related industries

SEMI D58-0310 (first published)

G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded Standardization of these component interfacesThe purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die bonding process. This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds