G07100 - SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials StdPbc-0812 org in March 2005

org in March 2005

This standard is intended to establish the definitions

including lithography and electrical contact between metal layers on the bonded wafers

SEMI半導体製造装置通信スタンダード2（SECS-II）は，インテリジェント装置とホスト間で交換するメッセージの解釈について詳細に定義している。本仕様は，日本電子工業振興協会（JEIDA）の第12委員会の協力により規定された。

NOTICE: This Document was completely rewritten in 2016

G07100 - SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials StdPbc-0812 org in March 2005This Specification describes a common format, content, size, and location for printed, machine readable labels on an intermediate container of materials used for semiconductor packaging. This Specification provides for a smooth transition from existing traceability and labeling procedures to a comprehensive, unified system envisioned for the future. This Standard applies to the following packaging materials: Leadframe Molding compound Bonding wire Die