E07200 - SEMI E72 - Specification and Guide for Equipment Footprint, Height, and Weight StdTpc-Wafer Edge Profile Maintenance

Maintenance

and SEMI E112

graphite furnace atomic absorption spectroscopy (GFAAS)

This Guide contains definitions of terms and procedures for determining the leak rates of MFCs as used in the semiconductor industry

Nanotopography is the non-planar deviation of the whole front wafer surface within a spatial wavelength range of approximately 0

E07200 - SEMI E72 - Specification and Guide for Equipment Footprint, Height, and Weight StdTpc-Wafer Edge Profile MaintenanceThis Standard was technically approved by the Physical Interfaces & Carriers Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 31, 2016. Available at www. semiviews. org and www. semi. org in October 2016; originally published in 1998; previously published March 2005. NOTICE: This Document was completely rewritten in 2016 To help semiconductor device manufacturers plan or