E04000 - SEMI E40 - 프로세싱 관리 표준 StdVol-Silicon Materials & Process Control ロボットおよび工場インタフェース

ロボットおよび工場インタフェース

and the sawing of the bonded wafers) is beyond the scope of this Test Method

The first stack (refer to Figure 1) is a BWS pair of 775 µm thick wafers following TSV formation and the bonding operation

·    限制條件

• Leakage

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