C10400 - SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing Revision:SEMI C104-0622 - Current than the current industry process

than the current industry process of record (POR) shore hardness (SH)

Identify key types of ceramics and composites and their design considerations

All liquid chemical standards consist of guidelines

having a front side emitter

This Specification describes requisite test structures

C10400 - SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing Revision:SEMI C104-0622 - Current than the current industry processThis Guide provides directions for measurements and reporting the parameters of chemical mechanical planarization (CMP) pad windows. This Guide provides directions for reporting metrology tools used to measure parameters of the CMP pad windows. This Guide provides the list of the parameters for CMP pad windows required to measure and report on quality documents. Reference to this Guide can be used in the quality documents (i. e., in the technical data