S00200 - SEMI S2 - Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Revision:SEMI S2-1016a - Superseded whole-wafer flatness) use a center-referenced

whole-wafer flatness) use a center-referenced coordinate system

sensors and actuators) and higher level devices such as controllers

The unit in these figures is inch

This Test Method is used to measure die strength for dies from processed wafers

1  This Standard applies to data collection related to the portion of equipment recipe execution that directly affects the processing locations (process modules and process areas) within production equipment

S00200 - SEMI S2 - Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Revision:SEMI S2-1016a - Superseded whole-wafer flatness) use a center-referenced* This Safety Guideline has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version.