C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing StdPbc-0094 For event information

For event information

· オプションA: 能動搬送（能動OHSなど）で内部ストッカーのロードポートに水平にFOUPを移載する。図1にオプションAを示す。

搬送ジョブの実行および履歴についてのデータを収集し，記録する。

그 내용이 가지는 의미와 장비에서 지원하는 데이터가 어떤 인터페이스로 관리되는지를 정의한다

SEMI MF728-1106 (Reapproved 0317)

C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing StdPbc-0094 For event informationThe purpose of this Document is to provide a guide for the measurement of and reporting of particle size distributions (PSD) for chemical mechanical planarization (CMP) slurries. Most CMP slurries have a wide range of particle sizes from a few nanometers to several hundreds of nanometers. This Guide does not define which measurement technique should be used but focuses on the parameters to report on a Certificate of Analysis (CoA) and on the roadmap