M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn however the definitions used are

however the definitions used are subject to interpretation

This document describes standard behaviors for automated transfer of substrates among automated material handling systems (AMHS) and equipment at FPD fabs

7 125mm鏡面研磨単結晶シリコンウェーハ（セカンダリフラットあり）

SafetyBUS pは，通信モデルおよびプロトコルを定める。物理層およびデータ･リンク層の定義はコントローラ・エリア・ネットワーク（CAN）技術によって定義され，CAN仕様は媒体アクセス制御（MAC）方法論と物理的な信号伝達特性を提供する。

mask makers and mask users are hindered in the communication with each other

M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn however the definitions used areThis standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on November 21, 2006. It was available at www. semi. org in February 2007. Originally published in 1992; previously published March 2003. NOTICE: This document was balloted and approved for withdrawal in 2007. Dielectrically isolated (DI) wafers are used for fabricating specialized