S02700 - SEMI S27 - 環境，健康，安全（ESH）評価報告書の内容に関する安全ガイドライン Revision:SEMI S27-0310 - Inactive This Guide is intended to

This Guide is intended to address the application of adapter plates for process equipment cluster tools and single module process equipment whose installation requirements are typically complex (e

covered by native oxide

3  Manufacturing processes incorporating bonded wafers typically require thinned wafers

The Test Method is focused only and specifically on near edge geometry applications

NOTICE: Paragraphs entitled ‘NOTE:’ are not an official part of this Standard and are not intended to modify or supersede the official Standard

S02700 - SEMI S27 - 環境，健康，安全（ESH）評価報告書の内容に関する安全ガイドライン Revision:SEMI S27-0310 - Inactive This Guide is intended toNOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI Environmental Health & Safety Global Technical Committee20091216global Audits and Reviews Subcommittee20102www. semi. org NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current