MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices Revision:SEMI MS12-0220 (Reapproved 1125) - Current · Film deposition equipment (CVD

·    Film deposition equipment (CVD & PVD)

This Practice covers a methodology to determine the costs associated with misclassification of product due to variability and bias of measurement equipment

transportation

Secondary ion mass spectrometry (SIMS) can measure on polished silicon wafer product the following:

Parameters such as edge length and diagonal of a wafer appear to be obvious

MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices Revision:SEMI MS12-0220 (Reapproved 1125) - Current · Film deposition equipment (CVD1 Purpose 1. 1 Although the substrates used in the production of MEMS share many physical and electrical properties with those used in IC manufacturing there are some significant differences as well. There exists a need to standardize MEMS substrates to allow the stocking of standard material, lowering the time to purchase, time to market and overall cost. This specification provides the necessary information for ordering and specifying such