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G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive SEMI D22-0818 (Reapproved 0924)
G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive SEMI D22-0818 (Reapproved 0924)
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Description
SEMI D22-0818 (Reapproved 0924)
timeliness
SEMI A2 — Specification for Surface Mount Assembler Smart Hookup (SMASH)
This Document describes a test method to characterize the composition and thickness of the chromium-enriched oxide layer of stainless steel surfaces and to detect surface contamination in tubing
This Standard stipulates materials relating to transport of 300 mm wafers using shipping boxes (FOSB) regulated by SEMI M31
G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive SEMI D22-0818 (Reapproved 0924)global Assembly & Packaging Technical Committee2012221global Audits and Reviews Subcommittee20124www. semiviews. org www. semi. org BGA Referenced SEMI Standards None.
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