G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds StdTpc-Lead Finishes originally used for indicating optical

originally used for indicating optical direction of the films

SEMI E116-0623 (technical revision)

This document covers requirements for dichlorosilane (SiH2Cl2) used in the semiconductor industry

SEMI MF1726-1110 (technical revision)

This Document describes the procedures for testing the leak integrity

G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds StdTpc-Lead Finishes originally used for indicating opticalNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document describes procedures for evaluating epoxy molding compounds by differential scanning calorimetry (DSC). This test method uses SI units. Referenced SEMI Standards (purchase separately) None. Revision History